Intel is exploring a return to the memory market as CEO Lip-Bu Tan identifies new storage technologies as a strategic area of interest. The company has launched a project focused on novel memory architectures, signaling a shift from Tan's previous view of memory as a commodity business.
To lead this initiative, Intel hired former SK Hynix head Seok-Hee Lee. The strategy involves a closer integration of processors and memory, including stacking memory directly on top of chips. Intel also holds a patent for XBM, an architecture that connects memory stacks without a silicon interposer.
This move addresses the surging memory demands of AI applications. By pursuing advanced architectures like XBM and vertical stacking, Intel aims to eliminate traditional bottlenecks. This pivot marks a significant change in how the company plans to handle high-performance computing and data throughput.