Sony and TSMC have signed a non-binding memorandum of understanding to build a $6.3 billion semiconductor facility in Kumamoto, Japan. The joint venture, expected to launch by March 2027, will focus on developing and manufacturing next-generation CMOS sensors.
The project involves a 1 trillion Yen investment to expand Sony's existing Koshi site with new R&D and production lines. Sony will hold a 60 percent stake, while TSMC takes 40 percent. Mass production is slated for 2029, utilizing local green energy resources.
This partnership aims to supply sensors for future Apple iPhones and 'Physical AI' applications in robotics and vehicles. Sony CEO Hiroki Totoki noted the move supports a 'Fab-Light' strategy, reducing capital risks while leveraging TSMC's local expertise.