TSMC has secured land in the Longtan Science Park for two 1.4nm fabrication plants and a panel-level advanced packaging facility. The expansion zone has grown to 104.19 hectares, with 88 percent of the 1.4nm site land previously owned by local residents.
The project marks a return to the site after TSMC canceled its Phase 3 expansion in October 2023. Pilot production for the 1.4nm process is slated for the second half of 2027, following a $49 billion investment estimate for four sub-2nm production plants.
This expansion supports TSMC's goal of 100,000 monthly 2nm wafers by late 2026. The 1.4nm facilities are critical for future hardware, as Apple is expected to utilize the advanced node for its A22 Pro SoCs scheduled for release during the 2028 calendar year.