Taiwan Semiconductor Manufacturing Company (TSMC) has achieved a 98% yield for several AI-related products using its CoWoS packaging technology. Ho Chun, VP of Advanced Packaging, confirmed the milestone for packages utilizing a 5.5x reticle size process.
The CoWoS 5.5x process creates packages 5.5 times larger than a single lithographed chip by stitching compute and memory components. Ho Chun noted that packages exceeding 3x the photomask size must meet strict automotive heat tolerance standards to function.
This yield success addresses common defects like underfill air bubbles and bump misalignment. TSMC plans to scale this technology further, targeting a 14x reticle size by 2029 to meet the growing hardware demands of increasingly complex AI infrastructure.