A first-generation PlayStation 5 owner recently reported significant overheating issues, leading to a disassembly that revealed an irregular distribution of the console's liquid metal thermal interface. The conductive material was found dry and oxidized.
While Sony utilizes liquid metal for its superior thermal conductivity between the APU and cooling system, this case highlights how the substance can move or react with surfaces over time. Replacing the degraded metal successfully restored normal temperatures.
PS5 overheating is typically linked to dust, fan wear, or clogged radiators. However, this instance suggests that pressure issues or material oxidation between the heatsink and APU remain critical factors for long-term hardware stability and performance.