Two desoldered engineering samples of a new Qualcomm processor, tentatively named Snapdragon 8 Elite Gen 6 Pro, have appeared on the Chinese marketplace Xianyu. Listed by a Shenzhen seller for CNY 300, the chips are laser-marked with the model SM8975-100-BC.
The chips feature lot codes FC5528M5 and FX602R8T, identifying TSMC as the fab and Amkor sites in Korea and Japan for packaging. The codes indicate production in late 2025 and early 2026, with OEM sample units becoming available starting February 3, 2026.
These processors include an internal heat spreader and support both LPDDR6 and LPDDR5X memory via 1,295-ball and 496-ball FBGA packages. This leak precedes the Snapdragon Summit on September 22, where Qualcomm previously teased two Snapdragon 8 Elite chips.