Intel Resolves 18A Yield Issues, Ramps Production

Intel has fixed wafer-to-wafer yield variability for its 1.8nm 18A process, ramping production to 15,000 wafers per month at two sites.

According to BlueFin Research Partners, Intel has successfully addressed wafer-to-wafer yield variability issues within its 1.8nm-class 18A process technology. This variability previously resulted in inconsistent wafer quality within the same production flow. Intel is now ramping production to between 12,000 and 15,000 wafers per month, utilizing a total capacity of 30,000 wafer starts across the D1X development fab in Oregon and Fab 52 in Arizona. The 18A node will power upcoming products including Core Ultra 3 'Panther Lake' and Xeon 6+ 'Clearwater Forest' processors, following a consistent yield improvement rate of 7% per month. Looking ahead, Intel plans to use the D1X facility for initial high-volume manufacturing of its 1.4nm 14A process. High-volume 14A production is slated for 2029, while the first phase of the Ohio One manufacturing site is expected to be completed by 2030 and come online between 2030 and 2031.