Qualcomm Unveils Dragonfly Data Center Solutions

Qualcomm announces the Dragonfly C1000 CPU and AI300 accelerator, alongside a multi-year data center CPU agreement with Meta.

At its June 24, 2026 Investor Day, Qualcomm Technologies, Inc. expanded its data center portfolio with the new Dragonfly C1000 CPU, Dragonfly AI300 inference accelerator, and High Bandwidth Compute (HBC) technology. The Dragonfly C1000 CPU features custom Oryon cores optimized for frequencies exceeding 5 GHz, utilizing a 250+ core count chiplet design with PCIe Gen 7 support for speeds over 2 TB/s. Qualcomm also announced a multi-year agreement with Meta to supply data center CPUs, with the C1000 planned to power Meta's next-generation server fleet. The Dragonfly AI300 joins the AI200 and AI250 lineup, integrating HBC Gen 2 technology and supporting UALink and ESUN scale-up. HBC Gen 1 with AI250, a 3D-stacked silicon solution enabling 133 TB/s per card, begins sampling in mid-2027. Commercial availability for the C1000 and AI300 is expected in 2028.