Rapidus to Launch 2-nm Chip Production by 2027

Japanese startup Rapidus aims to challenge TSMC with 2-nm chips priced at 3 million Yen, backed by state funding and major tech investors.

Rapidus, a state-funded Japanese semiconductor startup, plans to begin mass production of 2-nm chips by mid-2027. The company aims for a monthly capacity of 30,000 wafers, utilizing IBM-based Gate All Around (GAA) technology and 600 x 600 mm Panel Level Packaging. Rapidus intends to price its wafers between 3 million and 3.5 million Yen, positioning itself as a cost-competitive alternative to TSMC. The project has attracted 167.6 billion Yen in investment from 32 companies, including Sony, SoftBank, Fujitsu, and Canon, with 60 firms expressing manufacturing interest. Looking toward the future, the CEO stated in April 2026 that he envisions building chips on the moon.