SK hynix has officially addressed recent industry reports regarding the potential use of Intel Foundry as an external supplier for HBM base dies. The company clarified that specific claims about Intel manufacturing these components are currently inaccurate.
As HBM4 shifts toward a logic-semiconductor process, the base die plays a critical role in coordinating communication between stacked DRAM and host accelerators. However, external manufacturing adds significant costs and complex supply-chain requirements.
While Intel Foundry was named as a candidate by ITHome, SK hynix confirms there is no active contract. Proper HBM qualification requires the base die to integrate seamlessly into advanced-packaging flows, and no such partnership is currently established.