TSMC currently holds a stockpile of Apple processors valued at $1 billion while awaiting DRAM deliveries from suppliers. The foundry cannot finish assembly until these memory dies are integrated into a new 3D wafer-level fan-out package for the iPhone 18.
The InFO-PoP technology places memory directly above the SoC die, eliminating the need for LPDDR5X modules to occupy 100 mm² of PCB space. Apple is securing supplies from Micron, SK hynix, and Samsung, though CXMT reportedly rejected a discount request.
With the iPhone 18 and iPhone Ultra launch scheduled for late 2026, timing is critical as the packaging process takes up to two weeks. Securing these DRAM components is essential for TSMC to meet production deadlines for Apple's next-generation devices.