Chinese Brands Eye Custom LLW DRAM for Phones

Rumors suggest Chinese smartphone makers are developing custom Low Latency Wide DRAM to boost performance and efficiency by 2027.

A new rumor indicates that Chinese smartphone brands are developing custom-made Low Latency Wide (LLW) DRAM to address performance bottlenecks inherent in LPDDR RAM. Utilizing an integrated design similar to High Bandwidth Memory (HBM), LLW reportedly delivers 1.5 times the performance and a 50 percent reduction in power consumption compared to unspecified standards. While a Weibo tipster suggests little hope for a 2026 rollout, the second half of 2027 is viewed as a more likely window for the technology's introduction. This development coincides with broader industry shifts, as Huawei reportedly explores HBM for smartphones, Apple considers HBM for the iPhone 20, and Samsung works on complex packaging for handset HBM. Additionally, Qualcomm is rumored to be collaborating with Chinese memory manufacturers to integrate 3D DRAM into its NPUs.