Intel CFO David Zinsner announced that the upcoming Intel 14A manufacturing process is showing its best defect density curve since the 22-nm node. While the 22-nm process initially faced zero percent yields, 14A is tracking for risk production in 2027.
The company will release the 14A Process Design Kit version 0.9 this October. Production will utilize the Oregon R&D facility and Arizona's Fab 62, while construction accelerates on the Ohio Mod 1 module to support full serial production starting in 2028.
Intel expects its packaging technologies, including EMIB-T, to drive significant revenue by 2028. Following the 2026 launch of a Malaysian packaging complex, these advanced options aim to provide critical market access for the Intel Foundry business unit.