Intel Develops Hyper-Large 240mm Chip Packages

Intel is advancing hyper-large form factor (HLFF) packaging at its Rio Rancho facility, targeting 240mm x 240mm dimensions and 24x reticle sizes. Utilizing EMIB and Foveros technologies alongside glass substrates, the company has overcome underfill flow limits, which typically cap at 22mm. Intel's encapsulation solution uses a multi-point dispensing strategy to achieve void-free results at flow distances up to 40mm. Recent milestones include a validated 5x reticle EMIB package with 18 dies and 12 HBM sites, plus a tiled EMIB package exceeding 7x reticle size. Foveros 3D packaging has also reached 2x and 4x reticle scales, with the 2x version passing full reliability tests. Intel's roadmap aims for 12x reticle sizes in the near term and panel-level packages exceeding 50x reticle size.