UMC Expands Fab Capacity in Singapore and Taiwan

UMC's Board of Directors approved a phased expansion plan in Singapore and Taiwan to meet demand for AI and edge-computing applications.

United Microelectronics Corporation (UMC) is initiating a phased expansion plan to address rising customer demand for AI and edge-computing applications. Chairman Stan Hung confirmed the Board of Directors' approval for cleanroom installation and silicon photonics tool procurement at the Phase 4 facility in Singapore, the company’s largest site outside of Taiwan. While the Singapore building shell is already complete, UMC will also start construction on a new fab building shell at its flagship Tainan campus in Taiwan. This new structure will house future Phase 7 and Phase 8 facilities and is designed to expand UMC’s advanced packaging footprint. These investments across its global semiconductor foundry network aim to strengthen the company's capacity for advanced technology and support its international customer base.