Intel Completes RAMP-C Semiconductor Program

Intel Foundry and the U.S. Department of War conclude the RAMP-C program to advance domestic CMOS technology and 18A manufacturing.

Intel has successfully completed the RAMP-C program, an initiative launched in September 2021 to support domestic CMOS technology development and manufacturing in the United States. Collaborating with the U.S. Department of War, Intel Foundry progressed through three phases of the program, which focused on Intel 18A fabrication. This fabrication process introduces RibbonFET and PowerVia technologies as Intel continues to research, develop, and manufacture semiconductor technology domestically. Building on this momentum, the Secure Enclave program will now expand semiconductor manufacturing for the U.S. government. The Secure Enclave initiative specifically builds upon the State-of-the-art Heterogeneous Integrated Packaging program to further domestic production capabilities.