CXMT Advances Hybrid Bonding DRAM Using DUV Tech

Chinese memory maker CXMT is testing Wafer-to-Wafer Hybrid Bonding to advance DRAM production despite U.S. sanctions on EUV equipment.

ChangXin Memory Technologies (CXMT) has launched R&D for a new DRAM class using DUV machinery at a pilot line in Hefei, China. The company is testing Wafer-to-Wafer Hybrid Bonding, which replaces traditional microbumps by separating memory cell arrays and peripheral control logic onto different wafers. This high-density architecture shortens wire lengths to increase transmission speeds and reduce power consumption. While Samsung and SK hynix dominate the global market, CXMT holds 119 related patents and has attracted interest from Apple. These developments occur under the Trump Administration as U.S. sanctions block EUV exports to China. The move targets the AI datacenter market, which is projected to claim over 60 percent of memory shipments by 2027.