CXMT Plans Second Beijing DRAM Fab to Boost Output

Chinese memory manufacturer CXMT is planning a second DRAM fabrication plant in Beijing, reportedly securing local government backing to fund the project, which could cost over $10 billion. Currently, CXMT operates two 12-inch fabs in Hefei and Beijing, each producing 100,000 wafers per month for a total capacity of 200,000. The company aims to reach 350,000 wafers per month by the end of 2026, nearing Micron’s current output of 375,000. Long-term goals include a total capacity of 600,000 wafers per month once Shanghai and Hefei plants are fully operational. Notably, CXMT constructs cleanrooms in just 12 months, significantly faster than the two-year industry standard, accelerating its expansion in the global semiconductor market.