TSMC to Scale 2nm Production to 100,000 Wafers
TSMC accelerates its 2nm process node expansion to meet demand from major clients like NVIDIA, AMD, and Broadcom by the end of 2026.
TSMC is significantly increasing its 2nm process capacity, aiming for 100,000 monthly wafers by the end of 2026, a sharp rise from the previous 20,000 units at Fab 20. The node has already seen four times as many tapeouts as the 3nm process and contributed 3 percent of TSMC's Q3 2026 revenue. Key customers include NVIDIA, AMD, and Broadcom, with AMD's MI455X GPUs targeting NVIDIA's Rubin Ultra. Apple's A20 Pro chip is expected to debut in the iPhone 18 Pro and iPhone 18 Pro Max in September, while Qualcomm and MediaTek prepare flagship SoCs for 2027. While TSMC targets 180,000 monthly wafers for its 3nm process, the company reportedly plans a transition to a 1.4nm node following two generations of the 2nm process.