CXMT is scheduled to begin mass production of LPDDR6 RAM this September. The memory is reserved for the Xiaomi 18 Fold, a wide-folding handset featuring the XRING 03 chipset. This 3nm N3P processor is reported to be the first to support the new LPDDR6 standard.
Despite being on the U.S. entity list, CXMT utilizes Deep Ultraviolet (DUV) machinery and multi-patterning techniques to manufacture these chips. The company maintains a strategic partnership with Xiaomi to supply DRAM, competing with Samsung, SK hynix, and Micron.
The Next Web estimates XRING 03 shipments will not exceed 300,000 units, while the Xiaomi 18 Fold is expected to ship fewer than 500,000 units. This limited scale reflects the niche nature of the folding device market and the specific hardware requirements.