Renesas Debuts Gen 3 DDR5 MRDIMM Chipset Solutions

Renesas Electronics Corporation announced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line Memory Module (MRDIMM) chipset solutions on July 30, 2026. Delivering server-class speeds up to 16,000 MT/s, the new components offer 25 percent higher memory bandwidth than second-generation solutions while maintaining compatibility with existing DDR5 infrastructure. The Gen 3 lineup features the RRG5013 Multiplexed Registering Clock Driver (MRCD) and RRG5103 Multiplexed Data Buffer (MDB), incorporating Device Equalization Self-Train Mode (DESTM) Quality Indication Status. The platform also includes Power Management ICs, SPD Hubs, and temperature sensors. Sameer Kuppahalli of Renesas and Amit Goel of AMD noted the advancement. Sampling is underway as of July 30, 2026, with production slated for H2 2027. Renesas will demonstrate the hardware at FMS 2026 in Santa Clara.