SK hynix CEO Kwak Noh-Jung announced that the global memory shortage is expected to persist through 2030. The company recently held a groundbreaking ceremony for its new packaging and testing facility in Indiana to address surging demand for AI components.
The Indiana site will focus on HBM4E packaging using wafers shipped from South Korea. Cleanroom operations are scheduled for late 2028, with volume production starting in Q3 2029. Notably, this facility will not add new wafer capacity to the supply chain.
This long-term shortage forecast extends previous estimates that saw tight DRAM supply lasting until 2028. As AI-driven demand shifts customers toward customized HBM configurations, these specialized packaging sites become critical for the semiconductor industry.