SK Hynix to Mass Produce 375-Layer NAND by 2026

SK Hynix has verified its 375-layer NAND solution for 2026 production as industry demand for Molybdenum wiring materials surges.

SK Hynix is set to begin mass production of its 375-layer NAND Flash solution, internally labeled as 400-layer, by the end of 2026. According to The Elec, the company has completed verification of the technology and will utilize existing fabs currently producing 321-layer V9 NAND. To address resistance issues in narrowing wiring bonds, SK Hynix plans to replace Tungsten film with Molybdenum, a material Samsung already utilizes. Samsung is also optimizing its processes for 400-layer V-NAND in 2026 with a long-term goal of 1000-layer dual stacking. Samsung purchased 4 tons of Molybdenum in 2025 and 10 tons in 2026, while SK Hynix is expected to consume 4 tons. Total industry demand for Molybdenum is projected to rise from 25 tons in 2027 to 80 tons by 2030 as SK Hynix develops 480-layer and 604-layer products.